Through wiring substrate
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United States of America Patent
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Mar 27, 2018
Issued Date -
N/A
app pub date -
Apr 28, 2017
filing date -
Apr 28, 2016
priority date (Note) -
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status (Latency Note)
Importance
Abstract
A through wiring substrate comprises a substrate having a pair of principal surfaces and a through hole penetrating between the pair of principal surfaces, the pair of principal surfaces and an inner surface of the through hole being electrically insulative; a through electrode provided on the inner surface of the through hole; a first wiring layer provided on one of the principal surfaces and connected to the through electrode; a second wiring layer provided on the other of the principal surfaces and connected to the through electrode; an underlying metal layer provided between the one of the principal surfaces and the first wiring layer; and catalyst metal particles existing between the underlying metal layer and the first wiring layer and between the through electrode and the inner surface of the through hole.
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