Bonding structure and method of fabricating the same

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United States of America Patent

PATENT NO 9931813
SERIAL NO

12774731

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Abstract

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A bonding structure and a method of fabricating the same are provided. A first substrate having a first bonding element and a second substrate having a second bonding element are provided, wherein at least one of the first bonding element and the second bonding element is formed with an alloy. A bonding process is performed to bond the first bonding element with the second bonding element, wherein a diffusion liner is generated at the exposed, non-bonded surface of the bonding structure.

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Patent Owner(s)

Patent OwnerAddress
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEHSINCHU

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Kuan-Neng Taipei County, TW 66 1038
Ko, Cheng-Ta Hsinchu, TW 78 166
Lo, Wei-Chung Taipei, TW 26 335

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