Semiaromatic polyamide, semiaromatic polyamide resin composition, and molded article

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United States of America Patent

PATENT NO 9932444
SERIAL NO

14441954

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Abstract

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To provide: a semiaromatic polyamide which has excellent moldability, heat resistance, chemical resistance and mechanical characteristics; and a molded article of this semiaromatic polyamide. A semiaromatic polyamide (I) of the present invention contains 35-50% by mole of a structural unit derived from terephthalic acid [A], 25-40% by mole of a structural unit derived from isophthalic acid [B], 15-35% by mole of a structural unit derived from an aliphatic dicarboxylic acid [C] (provided that the total of [A], [B] and [C] is 100% by mole), and a structural unit derived from an aliphatic diamine [D] having 4-12 carbon atoms. The molar ratio ([A]/[B]) is from 65/35 to 50/50, and the molar ratio ([C]/[B]) is from 30/70 to 50/50. The melting enthalpy ([increment]H) of the semiaromatic polyamide (I) as determined by differential scanning calorimetry (DSC) is 20-40 mJ/mg, and the intrinsic viscosity of the semiaromatic polyamide (I) is 0.7-1.6 dl/g.

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Patent Owner(s)

Patent OwnerAddress
MITSUI CHEMICALS INC2-1 YAESU 2-CHOME CHUO-KU TOKYO 1040028 ?1040028

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Amano, Akinori Chiba, JP 10 61
Ebata, Hiroki Yokohama, JP 21 142
Kageyama, Fumio Ichihara, JP 41 675
Kosaka, Toshitaka Otake, JP 3 15
Ogasawara, Hideto Sodegaura, JP 12 95
Takizawa, Nobuhiro Kamakura, JP 10 73
Washio, Isao Chiba, JP 14 61

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