Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of alpha amino acids and bisepoxides

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United States of America Patent

PATENT NO 9932684
SERIAL NO

15220472

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Abstract

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Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of α-amino acids and bisepoxides to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.

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Patent Owner(s)

Patent OwnerAddress
DDP SPECIALTY ELECTRONIC MATERIALS US INC1501 LARKIN CENTER DRIVE MIDLAND MI 48642

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Dziewiszek, Joanna Boxborough, US 8 29
Lefebvre, Mark Hudson, US 33 259
Niazimbetova, Zuhra Westborough, US 8 18
Qin, Yi Westborough, US 197 1107
Reddington, Erik Ashland, US 26 268
Thorseth, Matthew Westminster, US 7 14
Woertink, Julia Midland, US 7 25

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