Known good die testing for high frequency applications
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United States of America Patent
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Apr 3, 2018
Issued Date -
N/A
app pub date -
May 4, 2015
filing date -
May 4, 2015
priority date (Note) -
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status (Latency Note)
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Abstract
Embodiments contained in the disclosure provide a method and apparatus for testing an electronic device. An electronic device is installed in a test socket guide. A pusher tip applies a load to the guided coaxial spring probes and forces contact with pads on the device. Test and ground signals are routed through the device and test socket. The apparatus includes a socket having at least one guided coaxial spring probe pin. A socket guide shim is positioned between the receptacle for the electronic device and the socket. A socket guide aids positioning. A pusher tip is placed on the side opposite that of the guided coaxial spring probe pins. The pusher tip mates with a pusher shim and the pusher spring. A top is then placed on the assembly and acts to compress the pusher spring and engage the guided coaxial spring probe pins with the pads on the device.
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