Copper paste composition and its use in a method for forming copper conductors on substrates

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United States of America Patent

PATENT NO 9934880
SERIAL NO

14960814

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Abstract

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This invention relates to a copper thick film paste composition paste comprising copper powder, a Pb-free, Bi-free and Cd-free borosilicate glass frit, ruthenium-based powder, and an organic vehicle. The invention also provides methods of using the copper thick film paste composition to make a copper conductor on a substrate. Typical substrates are selected from the group consisting of aluminum nitride, aluminum oxide and silicon nitride.

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Patent Owner(s)

Patent OwnerAddress
CELANESE MERCURY HOLDINGS INCBUILDING 304 EXPERIMENTAL STATION 200 POWDER MILL ROAD WILMINGTON DE 19803

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Labranche, Marc Henry Chapel Hill, US 2 4

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