CHAMBER WITH FLOW-THROUGH SOURCE
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United States of America Patent
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app pub date -
Oct 4, 2016
filing date -
Oct 4, 2016
priority date (Note) -
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status (Latency Note)
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Abstract
Described processing chambers may include a chamber housing at least partially defining an interior region of a semiconductor processing chamber. The chamber may include a showerhead positioned within the chamber housing, and the showerhead may at least partially divide the interior region into a remote region and a processing region in which a substrate can be contained. The chamber may also include an inductively coupled plasma source positioned between the showerhead and the processing region. The inductively coupled plasma source may include a conductive material within a dielectric material.
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