Adhesive sheet and method of manufacturing electronic component
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United States of America Patent
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Apr 3, 2018
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N/A
app pub date -
Jul 6, 2015
filing date -
Jul 14, 2014
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Abstract
An adhesive sheet is provided that is capable of inhibiting scraping up of an adhesive in the dicing step, does not cause chip detachment during dicing processing, facilitates picking up, and does not readily develop adhesive transfer. According to the present invention, an adhesive sheet is provided that comprises a substrate film and an adhesive layer laminated on the film, wherein the adhesive layer contains 100 parts by mass of a (meth)acrylate copolymer, from 5 to 250 parts by mass of a photopolymerizable compound, from 20 to 160 parts by mass of a softener, from 0.1 to 30 parts by mass of a curing agent, and from 0.1 to 20 parts by mass of a photopolymerization initiator, and the photopolymerizable compound has a weight average molecular weight from 40,000 to 220,000.
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