Power electronics arrangement and vehicle with said arrangement
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Apr 3, 2018
Issued Date -
N/A
app pub date -
Apr 14, 2017
filing date -
Apr 18, 2016
priority date (Note) -
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Abstract
A power electronics arrangement has a power semiconductor module, with a contact spring, with a load connecting element and with a mounting device which is embodied as part of an electrically operated vehicle. The power semiconductor module has a load connection element which preferably projects outwards from the interior of the power semiconductor module, and preferably has there a first external contact face for external connection, and the load-connecting element has a second contact face. An electrically conductive pressure contact connection is embodied between the first contact face and the second contact face by a contact spring, wherein the pressure on the contact spring which is necessary for this is implemented by connecting the power semiconductor module in a frictionally locking fashion to the mounting device.
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