Method for enhancing bond strength through in-situ peening

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United States of America Patent

PATENT NO 9938624
SERIAL NO

15025427

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Abstract

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One embodiment includes a method for enhancing bond strength between a powder deposit and a substrate. Powder is deposited on the substrate. Powder is shot peened with peening media that is harder than both the powder and the substrate to produce bond strength between the powder and the substrate that is at least twice bond strength between the powder and the substrate without shot peening.

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Patent Owner(s)

Patent OwnerAddress
RTX CORPORATION10 FARM SPRINGS ROAD FARMINGTON CT 06032

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
El-Wardany, Tahany Ibrahim Bloomfield, US 67 516
Klecka, Michael A Coventry, US 46 379
Nardi, Aaron T East Granby, US 102 708
Werkheiser, William East Hartford, US 5 39

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