Surface treatment in a chemical mechanical process

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United States of America Patent

PATENT NO 9941109
SERIAL NO

15197439

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Abstract

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A method is presented that includes the step of polishing a wafer positioned on a platen. After polishing the wafer, the method includes initiating a high pressure rinse on the wafer while the wafer is positioned on the platen, wherein the high pressure rinse includes a hydrophilic solution. The wafer is soaked in the hydrophilic solution, and after soaking the wafer, the wafer is cleaned.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD8 LI-HSIN RD 6 HSINCHU SCIENCE PARK HSINCHU 300-78

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Ying-Tsung Hsin-Chu, TW 64 556
Hong, William Weilun Hsin-Chu, TW 32 54
Liu, Chih-Wen Taoyuan, TW 19 50
Nien, Po-Chin Taipei, TW 12 22
Tu, Che-Hao Hsin-Chu, TW 21 72

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