Millimeter wave integrated circuit with ball grid array package including transmit and receive channels
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United States of America Patent
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Apr 10, 2018
Issued Date -
N/A
app pub date -
Apr 25, 2017
filing date -
Jun 16, 2014
priority date (Note) -
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Abstract
A millimeter wave integrated circuit (IC) chip. The IC chip comprises an IC die and a wire bond ball grid array package encapsulating the IC die. The wire bond ball grid array package comprises a solder ball array, a millimeter wave transmit channel, and a millimeter wave receive channel, wherein each millimeter wave transmit and receive channel electrically couples the IC die to a signal ball of the solder ball array and is configured to resonate at an operating frequency band of the millimeter wave IC chip.
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