Suspension board with circuit and producing method thereof
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United States of America Patent
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Apr 10, 2018
Issued Date -
N/A
app pub date -
Dec 5, 2016
filing date -
Dec 7, 2015
priority date (Note) -
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status (Latency Note)
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Abstract
A suspension board with circuit includes a metal supporting board, a conductor layer, a first insulating layer disposed between the metal supporting board and the conductor layer and having a first thickness, a second insulating layer having a second thickness in a portion disposed on the first insulating layer, and a pedestal disposed on the metal supporting board. The pedestal includes a first layer prepared from the same material as that of the first insulating layer and a second layer prepared from the same material as that of the second insulating layer. The thickness of the pedestal is different from any one of the first thickness, the second thickness, and the total sum of the first thickness and the second thickness.
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