Composition of a solder, and method of manufacturing a solder connection

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United States of America Patent

PATENT NO 9943930
SERIAL NO

14749703

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Abstract

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The solder composition comprises particles of a thermodynamically metastable alloy. One of the elements of the alloy will form an intermetallic compound with a metal surface. The solder composition is particularly suitable for use in bumping of semiconductor devices.

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Patent Owner(s)

Patent OwnerAddress
LUMILEDS LLC370 W TRIMBLE RD SAN JOSE CA 95131

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Biglari, Mohammad Hossain The Hague, NL 2 11
Van, Veen Nicolaas Johannes Antonius Eindhoven, NL 1 4

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