Preparation of corrosion-protective copper paste through single process and application thereof to dipole tag antenna
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United States of America Patent
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Apr 17, 2018
Issued Date -
N/A
app pub date -
May 27, 2014
filing date -
Nov 18, 2013
priority date (Note) -
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status (Latency Note)
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Abstract
Provided are a method of producing corrosion-protective copper paste through a single process and an application thereof to a dipole tag antenna. Copper powder is surface-etched by using a hydrochloric acid in an inert gas atmosphere, a phosphoric acid aqueous solution is added thereto to form copper phosphate on the etched surface of the copper powder, and then, a vinyl imidazole-silane copolymer and poly(4-styrenesulfonate) were introduced thereto to form a corrosion-protective coating layer on the surface of copper powder on which the copper phosphate has been formed, and a centrifuge and an agate mortar are used to prepare a copper paste having high viscosity and high dispersability. When a copper paste thin film is formed on a flexible film by screen printing, a produced dipole tag antenna may have high efficiency.
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International Classification(s)
- C03C:CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREO....
- C09D:COATING COMPOSITIONS, e.g. PAINTS, VARNISHES, LACQ....
- H01B:CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATER....
- H01Q:AERIALS
- B22F:WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES F....
- C23F:NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM S....
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