Structure and formation method of chip package with fan-out structure

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United States of America Patent

PATENT NO 9947552
SERIAL NO

15195321

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Abstract

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Structures and formation methods of a chip package are provided. The method includes forming multiple conductive structures over a carrier substrate and disposing a semiconductor die over the carrier substrate. The method also includes disposing a mold over the carrier substrate. The method further includes forming a protection layer between the mold and the carrier substrate to surround the semiconductor die and the conductive structures. In addition, the method includes removing the mold.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTDNO 8 LI-HSIN RD 6 HSINCHU SCIENCE PARK HSINCHU 300-78

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chang, Wei-Sen Jinsha Township, Kinmen County, TW 9 45
Chen, Meng-Tse Changzhi Township, Pingtung County, TW 100 1568
Chen, Shing-Chao Zhubei, TW 22 119
Cheng, Ming-Da Zhubei, TW 447 4774
Huang, Hui-Min Taoyuan, TW 110 1043
Kuo, Tin-Hao Hsinchu, TW 255 1772
Lin, Chih-Wei Zhubei, TW 359 5145
Pan, Kuo-Lung Hsinchu, TW 37 42
Tsai, Hao-Yi Hsinchu, TW 489 3426

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