Substrate cleaning apparatus, substrate cleaning method, and storage medium

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United States of America Patent

PATENT NO 9947556
SERIAL NO

14321054

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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There are provided first and second cleaning members which are configured to clean a central zone in a rear surface of a wafer when the wafer held by an absorption pad is horizontally held, and configured to clean a peripheral zone in the rear surface of the wafer when the wafer is held by the spin chuck. Due to the provision of the first and second cleaning members, detergency can be improved as compared with a case in which only one cleaning member is used. The first and second cleaning members are configured to be horizontally turned by a common turning shaft. When the central zone in the rear surface of the wafer is cleaned, the turning shaft is located to be overlapped with the wafer. Since the turning shaft is located by using the moving area of the wafer, a size of an apparatus can be reduced.

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Patent Owner(s)

  • TOKYO ELECTRON LIMITED

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kyouda, Hideharu Koshi, JP 38 321
Muta, Koshi Koshi, JP 13 35
Takiguchi, Yasushi Koshi, JP 32 177
Yamamoto, Taro Koshi, JP 102 883

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