Thermoplastic temporary adhesive for silicon handler with infra-red laser wafer de-bonding

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United States of America Patent

PATENT NO 9947567
SERIAL NO

14747670

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Abstract

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A bonding material including a phenoxy resin thermoplastic component, and a carbon black filler component. The carbon black filler component is present in an amount greater than 1 wt. %. The carbon black filler converts the phenoxy resin thermoplastic component from a material that transmits infra-red (IR) wavelengths to a material that absorbs a substantial portion of infra-red (IR) wavelengths.

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Patent Owner(s)

Patent OwnerAddress
INTERNATIONAL BUSINESS MACHINES CORPORATIONNEW ORCHARD ROAD ARMONK NY 10504

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Dang, Bing Chappaqua, US 162 1554
Gelorme, Jeffrey D Burlington, US 83 1150
Knickerbocker, John U Yorktown Heights, US 263 4114

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