Integrated circuit including NCEM-enabled, side-to-side gap-configured fill cells, with NCEM pads formed from at least three conductive stripes positioned between adjacent gates

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United States of America Patent

PATENT NO 9947601
SERIAL NO

15719513

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Abstract

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An integrated circuit, in the form of a wafer, die, or chip, includes multiple standard cell-compatible fill cells, configured to enable non-contact electrical measurements. Such fill cells include mesh pads that contain at least three conductive stripes disposed between adjacent gate stripes. Such fill cells further include geometry to enable non-contact evaluation of side-to-side shorts and/or leakages.

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Patent Owner(s)

Patent OwnerAddress
PDF SOLUTIONS INC2858 DE LA CRUZ BLVD SANTA CLARA CA 95050

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Brozek, Tomasz Morgan Hill, US 87 285
Cheng, Jeremy San Jose, US 117 290
Ciplickas, Dennis San Jose, US 88 367
Comensoli, Simone Darfo Boario Terme, IT 80 96
De, Indranil Mountain View, US 118 985
Doong, Kelvin Hsinchu, TW 81 177
Eisenmann, Hans Tutzing, DE 85 143
Fiscus, Timothy New Galilee, US 81 105
Haigh, Jonathan Pittsburgh, US 98 217
Hess, Christopher Belmont, US 123 1305
Kibarian, John Los Altos Hills, US 89 528
Lam, Stephen Freemont, US 123 1961
Lee, Sherry Monte Sereno, US 88 370
Liao, Marci Santa Clara, US 80 96
Lin, Sheng-Che Hsinchu, TW 86 96
Matsuhashi, Hideki Santa Clara, US 84 133
Michaels, Kimon Monte Sereno, US 88 271
O'Sullivan, Conor Campbell, US 93 243
Rauscher, Markus Munich, DE 89 822
Rovner, Vyacheslav Pittsburgh, US 80 96
Strojwas, Andrzej Pittsburgh, US 81 114
Strojwas, Marcin Pittsburgh, US 80 96
Taylor, Carl Pittsburgh, US 90 1035
Vallishayee, Rakesh Dublin, US 83 346
Weiland, Larg Hollister, US 81 96
Yokoyama, Nobuharu Tokyo, JP 80 96

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