Chemical mechanical planarization apparatus and methods

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United States of America Patent

PATENT NO 9950405
SERIAL NO

14445867

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Abstract

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A chemical mechanical planarization (CMP) apparatus is provided. The CMP apparatus includes at least one platen; and a polishing pad disposed on the platen. The CMP apparatus also includes a polishing head disposed above the platen and configured to clamp a to-be-polished wafer; and a basic solution supply port disposed above the platen and configured to supply a basic solution onto a surface of the polishing pad. Further, the CMP apparatus includes a slurry arm disposed above the platen and configured to supply a polish slurry on the surface of the polishing pad; and a deionized water supply port configured to supply deionized water onto the surface of the polishing pad. Further, the CMP apparatus also includes a negative power source configured to apply a negative voltage onto the surface of the polishing pad.

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Patent Owner(s)

Patent OwnerAddress
SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION18 ZHANGJIANG ROAD PUDONG NEW AREA SHANGHAI 201203
SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING) CORPORATION100176 BEIJING BEIJING DAXING DISTRICT ECONOMIC AND TECHNOLOGICAL DEVELOPMENT ZONE (YIZHUANG) 18 WENCHANG AVENUE MUNICIPAL DISTRICT BEIJING CITY 100176

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Deng, Wufeng Shanghai, CN 6 25

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