Multi-layer preform sheet

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United States of America Patent

PATENT NO 9950496
SERIAL NO

15342358

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Abstract

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A multi-layer preform sheet having at least a first layer and a second layer, the first layer being composed of a solder material that contains an intermetallic compound, and the second layer containing a first metal having a melting point of 300° C. or above, and a second metal capable of forming an intermetallic compound with the first metal.

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Patent Owner(s)

Patent OwnerAddress
NAPRA CO LTD8-15-17-204 OKUDO KATSUSHIKA-KU TOKYO 124-0022

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Sekine, Shigenobu Tokyo, JP 59 394
Shimaya, Chihiro Tokyo, JP 2 3

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