CMP porous pad with particles in a polymeric matrix

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9951054
SERIAL NO

12761016

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

The invention provides a chemical-mechanical polishing pad comprising a polymeric matrix and 0.1-15 wt. % of metal oxide particles. The polymeric matrix has pores, the metal oxide particles are uniformly distributed throughout the pores, and the metal oxide particles have a specific surface area of about 25 m2/g to about 450 m2/g. The invention further provides a method of polishing a substrate with the polishing pad.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
CMC MATERIALS LLC1209 ORANGE STREET WILMINGTON DE 19801

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kasthuri, Jaishankar Aurora, US 2 19
Li, Shoutian Naperville, US 22 185
Vacassy, Robert Aurora, US 22 175

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
7.5 Year Payment $3600.00 $1800.00 $900.00 Oct 24, 2025
11.5 Year Payment $7400.00 $3700.00 $1850.00 Oct 24, 2029
Fee Large entity fee small entity fee micro entity fee
Surcharge - 7.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00