Plating method for printed layer

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United States of America Patent

PATENT NO 9951424
SERIAL NO

15148191

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Abstract

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A plating method includes: providing a work piece which is metal or non-metal; forming a printed layer on a predetermined region of a surface of the work piece through printing electrical conductive material on the predetermined region; forming a plated layer through plating the printed layer and the surface of the work piece.

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Patent Owner(s)

Patent OwnerAddress
HOEY CO LTDNO 8 LANE 42 SEC 2 NANKAN ROAD LUZHOU DISTRICT TAOYUAN CITY 33855

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Huang, Joseph Taoyuan, TW 231 4929

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