Conductive film-forming bath

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United States of America Patent

PATENT NO 9951433
SERIAL NO

15034424

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Abstract

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An object of the present invention is to provide a novel conductive film-forming bath comprising an alkaline aqueous solution that can be used to form a film by electroplating on a non-conductive plastic material, the conductive film-forming bath being capable of forming a film by electroplating that has an excellent appearance and that does not suffer from reduced adhesiveness with respect to a non-conductive plastic material. The present invention relates to a conductive film-forming bath comprising an aqueous solution containing a copper compound, a complexing agent, an alkali metal hydroxide, and a water-soluble polymer having a polyoxyalkylene structure.

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Patent Owner(s)

Patent OwnerAddress
OKUNO CHEMICAL INDUSTRIES CO LTDJAPAN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kita, Koji Osaka, JP 80 702
Takeuchi, Yukiya Osaka, JP 2 4
Yoshikawa, Junji Osaka, JP 4 14

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