Laminated ceramic electronic component mounting structure
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United States of America Patent
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Apr 24, 2018
Issued Date -
Nov 12, 2015
app pub date -
May 4, 2015
filing date -
May 9, 2014
priority date (Note) -
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Abstract
A laminated ceramic electronic component mounting structure includes a laminated ceramic electronic component including a ceramic body, first and second inner electrodes in the ceramic body including opposed portions including at least portions of which are opposed to each other in a thickness direction of the ceramic body, a first terminal electrode electrically connected to the first inner electrode, and a second terminal electrode electrically connected to the second inner electrode; and a circuit board including first and second electrode lands electrically connected to the first and second terminal electrodes and on which the laminated ceramic electronic component is mounted, wherein widths of the first and second electrode lands are smaller than widths of the first and second inner electrodes at the opposed portions.
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