Method for forming solder bumps using sacrificial layer

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United States of America Patent

PATENT NO 9953908
SERIAL NO

14928263

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Abstract

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A barrier layer is formed over electrically conductive contact pads on a substrate such as a wafer. A photoresist layer is applied over the barrier layer, and openings in the photoresist layer are filled with solder to form solder bumps. The barrier layer may be removed from within the openings prior to filling the openings with solder. The process is applicable to fine pitch architectures and chip size packaging substrates. The photoresist layer and portions of the barrier layer outside of the openings are removed following solder fill.

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Patent Owner(s)

Patent OwnerAddress
INTERNATIONAL BUSINESS MACHINES CORPORATIONNEW ORCHARD ROAD ARMONK NY 10504

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lewandowski, Eric P White Plains, US 24 197
Nah, Jae-Woong Closter, US 159 1238
Sorce, Peter J Poughkeepsie, US 11 152

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