SGS or GSGSG pattern for signal transmitting channel, and PCB assembly, chip package using such SGS or GSGSG pattern

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United States of America Patent

PATENT NO 9955581
SERIAL NO

14992011

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Abstract

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A printed circuit board (PCB) assembly includes a PCB having a core substrate, a plurality of conductive traces on a first surface of the PCB, and a ground layer on the second surface of the PCB. The conductive traces comprise a pair of differential signal traces. An intervening reference trace is disposed between the differential signal traces. A connector is disposed at one end of the plurality of conductive traces. A semiconductor package is mounted on the first surface at the other end of the plurality of conductive traces.

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Patent Owner(s)

Patent OwnerAddress
MEDIATEK INCHSINCHU

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Nan-Jang Hsinchu, TW 38 406
Wong, Yau-Wai Hsinchu County, TW 8 44

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