Reduction of dielectric losses through use of organoclay in semiconductor or insulator compositions

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United States of America Patent

PATENT NO 9959951
SERIAL NO

12741116

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Abstract

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Organodavs are added to semiconductive compositions to provide a reduction in the dielectric losses of layered composites in which the semiconductive layer contains species which could migrate into the insulation and result in undesirably high dielectric losses, The invention semiconductive compositions provide improved performance in power cable applications.

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Patent Owner(s)

Patent OwnerAddress
UNION CARBIDE CORPORATION7501 STATE HIGHWAY 185 NORTH SEADRIFT TX 77983

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Eaton, Robert F Belle Mead, US 32 168
Person, Timothy J Freehold, US 70 137

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