Chucking warped wafer with bellows

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9960070
APP PUB NO 20160163580A1
SERIAL NO

14683555

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A vacuum chuck has at least one suction assembly that pulls a wafer surface toward a chucking surface. The suction assembly may be used with a wafer that is warped. A suction force engages a pad of a suction assembly with the wafer surface and retracts a bellows of the suction assembly. As the bellows retracts and draws the wafer surface closer to the chucking surface, the suction force provided by the vacuum chuck can pull the wafer flat.

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Patent Owner(s)

Patent OwnerAddress
KLA-TENCOR CORPORATIONONE TECHNOLOGY DRIVE MILPITAS CA 95035

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Huang, Luping Dublin, US 4 34

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