Built-in-electronic-component substrate and manufacturing method therefor
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United States of America Patent
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May 1, 2018
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N/A
app pub date -
Oct 30, 2015
filing date -
Nov 5, 2014
priority date (Note) -
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Abstract
A built-in-electronic-component substrate includes a core substrate, an electronic component mounted on one main surface of the core substrate via a joining member, and a resin layer including the electronic component embedded therein. The electronic component is a multilayer ceramic capacitor including a ceramic multilayer body, and a first outer electrode including an end surface portion and a second outer electrode including an end surface portion provided on end surfaces of the ceramic multilayer body. A first gap is provided between the resin layer and the end surface portion of the first outer electrode and the joining member and a second gap is provided between the resin layer and the end surface portion of the second outer electrode and the joining member.
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