Non-peripherals processing control module having improved heat dissipating properties
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United States of America Patent
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May 1, 2018
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app pub date -
Mar 25, 2013
filing date -
Oct 22, 2002
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Abstract
The present invention features a non-peripherals-based processing control unit having an encasement module that is very small and durable compared to conventional computer encasement structures. The process control unit is capable of being incorporated into various devices and/or environments, of accepting applied and impact loads, of functioning as a load bearing structure, as well as being able to be processed coupled together with one or more processing control units to provide scaled processing power. The processing control unit of the present invention further features a unique method of cooling using natural convection, as well as utilizing known cooling means, such as liquid or thermoelectric cooling.
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