Polishing liquid for CMP, polishing liquid set for CMP, and polishing method

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United States of America Patent

PATENT NO 9966269
SERIAL NO

15314692

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Abstract

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One embodiment of the present invention relates to a polishing liquid for CMP containing cerium oxide particles and water, wherein the half-value width of the main peak appearing within a range from 2θ=27.000 to 29.980° in a powder X-ray diffraction chart of the cerium oxide particles is from 0.26 to 0.36°, the average particle size of the cerium oxide particles is at least 130 nm but less than 175 nm, and the number of cerium oxide particles having a particle size of 1.15 μm or greater is 5000×103/mL or less.

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Patent Owner(s)

Patent OwnerAddress
RESONAC CORPORATIONTOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Oota, Munehiro Hitachi, JP 8 95
Shinoda, Takashi Albany, US 60 681
Tanaka, Takaaki Hitachi, JP 185 1739
Yoshikawa, Shigeru Hitachi, JP 19 235

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