Semiconductor wafer protective film and method of manufacturing semiconductor device

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United States of America Patent

PATENT NO 9966297
SERIAL NO

14894879

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Abstract

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According to the present invention, there is provided a semiconductor wafer protective film including a substrate layer (A) and an adhesive layer (C) formed on the substrate layer (A), in which the substrate layer (A) includes polymer, and a solubility parameter of the polymer determined by a Van Krevelen method is equal to or greater than 9.

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Patent Owner(s)

Patent OwnerAddress
MITSUI CHEMICALS TOHCELLO INCTOKYO 101-8485

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fukumoto, Hideki Nagoya, JP 10 88
Kataoka, Makoto Nagoya, JP 66 325
Morimoto, Akimitsu Nagoya, JP 12 61

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