Thermally conductive sheet, method for producing same, and semiconductor device
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
May 8, 2018
Issued Date -
N/A
app pub date -
Jun 18, 2014
filing date -
Jun 27, 2013
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A thermally conductive sheet, which contains: a binder; carbon fibers; and an inorganic filler, wherein the thermally conductive sheet is to be sandwiched between a heat source and a heat dissipation member of a semiconductor device, wherein the carbon fibers have an average fiber length of 50 μm to 250 μm, wherein thermal resistance of the thermally conductive sheet is less than 0.17 K·cm2/W, as measured in accordance with ASTM-D5470 with a load of 7.5 kgf/cm2, and wherein the thermally conductive sheet has an average thickness of 500 μm or less.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully