Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board
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United States of America Patent
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May 8, 2018
Issued Date -
N/A
app pub date -
Dec 21, 2015
filing date -
Dec 25, 2014
priority date (Note) -
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Abstract
A substrate for a printed circuit board according to an embodiment of the present invention includes a base film having an insulating property, and a conductive layer formed on at least one of surfaces of the base film. In the substrate for a printed circuit board, at least the conductive layer contains titanium in a dispersed manner. The conductive layer preferably contains copper or a copper alloy as a main component. A mass ratio of titanium in the conductive layer is preferably 10 ppm or more and 1,000 ppm or less. The conductive layer is preferably formed by application and heating of a conductive ink containing metal particles. The conductive ink preferably contains titanium or a titanium ion. The metal particles are preferably obtained by a titanium redox process including reducing metal ions using trivalent titanium ions as a reducing agent in an aqueous solution by an action of the reducing agent.
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