Mold
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United States of America Patent
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May 15, 2018
Issued Date -
N/A
app pub date -
Dec 26, 2011
filing date -
Dec 27, 2010
priority date (Note) -
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status (Latency Note)
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Abstract
A mold (100) according to the present invention is a mold used when curing a cylindrical laminate (30) obtained by laminating prepreg. The mold (100) includes a core die (10) located inside the laminate (30) and a surface die (20) that is located outside the laminate (30) and includes a plurality of partial surface dies (21 to 27). The partial surface dies (21 to 27) are arranged in a circumferential direction of the laminate (30) so as to cover the entire circumferential surface of the laminate (30). Each of the partial surface dies (21 to 27) is made of a fiber-reinforced resin in which a quantity of fiber having a grain direction in agreement with the circumferential direction differs from a quantity of fiber having a grain direction in agreement with an axial direction. Each of the partial surface dies (21 to 27) is constructed so that a coefficient of thermal expansion in the circumferential direction approximates a coefficient of thermal expansion of the core die (10) as compared with a coefficient of thermal expansion in the axial direction.
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