Resin compositions, resin molded articles, processes for preparing resin molded articles, and laser direct structuring additives

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United States of America Patent

PATENT NO 9969877
SERIAL NO

14895178

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Abstract

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Provided is a resin composition having higher platability. The resin composition contains at least two kinds of metals and also containing a conductive oxide having a resistivity of 5×103 Ω·cm or less.

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Patent Owner(s)

Patent OwnerAddress
MITSUBISHI ENGINEERING-PLASTICS CORPORATIONTOKYO 105-0021

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kikuchi, Tatsuya Kanagawa, JP 16 37
Yamada, Ryusuke Kanagawa, JP 14 31
Yamanaka, Yasushi Kanagawa, JP 104 1791

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