Adhesive sheet for semiconductor, and dicing tape integrated adhesive sheet for semiconductor
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United States of America Patent
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May 15, 2018
Issued Date -
N/A
app pub date -
Nov 7, 2008
filing date -
Nov 8, 2007
priority date (Note) -
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Abstract
There is provided an adhesive sheet for a semiconductor and a dicing tape integrated adhesive sheet for a semiconductor that are each good in cuttability when the sheets are each cut into individual pieces by expansion and are each good in embeddability into irregularities in a wiring board when the sheets are each molded thereto. An adhesive sheet for a semiconductor includes a resin composition containing a high-molecular-weight component and a filler, the breaking elongation of the adhesive sheet before curing is 40% or less at 0° C., and the elastic modulus of the adhesive sheet after curing is from 0.1 to 10 MPa at 175° C.
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