Microcapsule type curable resin composition
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United States of America Patent
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May 15, 2018
Issued Date -
N/A
app pub date -
Sep 8, 2014
filing date -
Sep 25, 2013
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A microcapsule type curable resin composition produces substantially no gases when applied to an adherend, e.g., to a threaded member, which is then tightened, moreover, due to exceptional coating properties to an adherend, does not give rise to coating irregularities. The microcapsule type curable resin composition contains (A) microcapsules encapsulating a curable compound (a), (B) a substance able to bring about curing of component (a), and (C) a binder able to adhere the microcapsules to an adherend, wherein the microcapsule type curable resin composition includes, per total 100 mass parts, (D) 1-25 mass parts of mica having average particle diameter of 10-150 μm, and (E) 1-25 mass parts of an inorganic filler having average particle diameter of 3-50 μm, the mass ratio of component (D) and component (E) being 0.2-2.0 of component (E) with respect to 1.0 of component (D).
First Claim
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International Classification(s)
- C09J:ADHESIVES; ADHESIVE PROCESSES IN GENERAL
- C08G:MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN B....
- C08F:MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONL....
- F16B:DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL E....
- C08L:COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08K:USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUB....
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