Metal particle dispersion for electroconductive substrates, method for producing the same, and method for producing an electroconductive substrate
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United States of America Patent
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May 15, 2018
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Oct 10, 2013
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Oct 15, 2012
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Abstract
The present invention is to provide a metal particle dispersion for electroconductive substrates, which has high dispersibility and dispersion stability and which is able to form a film that shows high electroconductivity after baking. Disclosed is a metal particle dispersion for electroconductive substrates, comprising metal particles, a dispersant and a solvent, wherein the dispersant is a graft copolymer having at least a constitutional unit represented by the following chemical formula (I) and a constitutional unit represented by the following chemical formula (II):
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