Substrate processing apparatus and methods
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United States of America Patent
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May 15, 2018
Issued Date -
N/A
app pub date -
Dec 31, 2015
filing date -
Oct 1, 2015
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Abstract
Apparatus and methods for processing substrates are disclosed. In some embodiments, a substrate processing system includes: a process chamber defining an interior volume for receiving a substrate and having a plasma forming zone, a substrate support positioned within the interior volume, a resonator coil disposed proximate the plasma forming zone, and a resonant inductor tuning circuit configured to vary an RF feed point location along the resonator coil. A method of operating a substrate processing system, according to embodiments, includes: transferring a substrate to a substrate support disposed within an interior volume of a processing chamber, the interior volume having a plasma forming zone, and operating a resonant inductor tuning circuit to couple an RF power source to a first RF feed point of a plurality of RF feed points along a resonator coil disposed proximate the plasma forming zone.
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