Apparatus for liquid treatment of wafer shaped articles
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United States of America Patent
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May 15, 2018
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app pub date -
Mar 7, 2016
filing date -
Mar 7, 2016
priority date (Note) -
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Abstract
An apparatus for treating a wafer-shaped article comprises a spin chuck configured to hold a wafer-shaped article of a predetermined diameter in a position wherein a lower surface of the wafer-shaped article is spaced a predetermined distance from an upper surface of the spin chuck. A treatment assembly is mounted above the upper surface of the spin chuck and underlying a wafer-shaped article when mounted on the spin chuck. The treatment assembly extends parallel to the upper surface from an axis of rotation of the spin chuck radially to a distance that is at least half the predetermined diameter. The spin chuck comprises upwardly projecting gripping pins configured to hold a wafer-shaped article in position, wherein the gripping pins do not pass through the treatment assembly.
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