Circuit board and manufacturing method thereof

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United States of America Patent

PATENT NO 9974166
SERIAL NO

15263388

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Abstract

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A circuit board including a substrate, a patterned circuit layer and a photo-imaginable dielectric layer is provided. The substrate has a first surface and a second surface opposite to each other. The patterned circuit layer is disposed on the first surface, and a line width of the patterned circuit layer gradually reduces from the first surface towards the second surface. The photo-imaginable dielectric layer is disposed in the substrate corresponding to the patterned circuit layer. In addition, a manufacturing method of the circuit board is also proposed.

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Patent Owner(s)

Patent OwnerAddress
UNIMICRON TECHNOLOGY CORPNO 179 SHANYING RD GUISHAN DIST TAOYUAN CITY 333

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lin, Chun-Ting Hsinchu County, TW 64 305
Wang, Tsung-Si Hsinchu, TW 2 0

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