Method and system of producing a multilayer element and multilayer element

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United States of America Patent

PATENT NO 9974189
SERIAL NO

14915338

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Abstract

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A method of producing a multilayer element with a substrate and at least one conductor structure connected in an areal manner to the substrate, which has first regions of electrically conductive material present in accordance with a prescribed pattern, electrically non-conductive second regions lying between the first regions to produce RFID antennas or flexible printed circuit boards in a roller-to-roller process, the method including connecting a conductor foil to the substrate by a laterally structured layer of adhesive lying in between such that in first regions a partial bonding contact between the substrate and the conductor foil is created at a multiplicity of bonding zones, and in laterally extended second regions the conductor foil is not connected or is connected less firmly by adhesive to the substrate; structuring the conductor foil by cutting the conductor foil along boundaries of the first regions; and removing contiguous pieces of foil of the conductor foil from laterally extended second regions.

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Patent Owner(s)

Patent OwnerAddress
3D-MICROMAC AG09126 CHEMNITZ

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Allenstein, Frank Chemnitz, DE 2 13
Clair, Maurice Plauen, DE 2 3
Kundt, Rocco Geringswalde, DE 2 1
Petsch, Tino Chemnitz, DE 3 38

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