Wafer Level Hermetic Seal Process for microelectromechanical systems (MEMS) devices
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United States of America Patent
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May 22, 2018
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app pub date -
Jun 3, 2015
filing date -
Jun 3, 2015
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Abstract
A microelectromechanical systems (MEMS) structure with a cavity hermetically sealed using a mask layer is provided. A capping substrate is arranged over a MEMS substrate, which includes a movable element. The capping substrate includes the cavity arranged over and opening to the movable element, and includes a seal opening in fluid communication with the cavity. The mask layer is arranged over the capping substrate. The mask layer overhangs the seal opening and laterally surrounds a mask opening arranged over the seal opening. A seal layer is arranged over the mask layer and the mask opening. The seal layer is configured to hermetically seal the cavity. A method for manufacturing the MEMS structure is also provided.
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