MEMS sensor device package housing with an embedded controllable device

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United States of America Patent

PATENT NO 9975760
SERIAL NO

15195061

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Abstract

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A microelectromechanical system (MEMS) sensor device includes a package housing having a top member, bottom member, and a spacer coupled the top member to the bottom member, defining a cavity. At least one sensor circuit and a MEMS sensor disposed within the cavity of the package housing. A first opening formed on the package housing a control device embedded within the package housing is electrically coupled to the sensor circuit and is controlled to tune the MEMS sensor from a directional mode to an omni-directional mode.

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Patent Owner(s)

  • ROBERT BOSCH GMBH

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Suvanto, Mikko VA Pittsburgh, US 4 11

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