Conductive paste, method for forming an interconnection and electrical device

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United States of America Patent

PATENT NO 9976042
SERIAL NO

15547462

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Abstract

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According to embodiments of the present invention, a conductive paste is provided. The conductive paste has a composition including a plurality of conductive nanoparticles and a plurality of conductive nanowires, wherein a weight ratio of the plurality of conductive nanoparticles to the plurality of conductive nanowires is between about 10:1 and about 50:1. According to further embodiments of the present invention, a method for forming an interconnection and an electrical device are also provided.

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Patent Owner(s)

  • NANYANG TECHNOLOGICAL UNIVERSITY; LOCKHEED MARTIN CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Gan, Chee Lip Singapore, SG 7 2
Lee, Byung Hoon Singapore, SG 37 308
Ng, Mei Zhen Singapore, SG 4 0
Zinn, Alfred A Bethesda, US 65 492

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