Method for bonding substrates to cold and damp surfaces
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United States of America Patent
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May 22, 2018
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app pub date -
Jun 15, 2015
filing date -
Jul 2, 2014
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Abstract
A description is given of a method, and of pressure-sensitive adhesive compositions suitable therefor, for bonding a substrate to cold and damp surfaces, the surface temperature being lower than the dewpoint temperature of the air in contact with the surface, and the pressure-sensitive adhesive composition comprising a pressure-sensitive adhesive polymer formed from defined amounts of 2-ethylhexyl acrylate, monomers selected from C1 to C2 alkyl (meth)acrylates, styrene, acid monomers, and optionally further monomers, in the presence of chain transfer agents.
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