Method of manufacturing electronic component and electronic-component manufacturing apparatus
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United States of America Patent
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May 22, 2018
Issued Date -
N/A
app pub date -
Jan 26, 2015
filing date -
Jan 31, 2014
priority date (Note) -
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Abstract
Electroconductive paste is applied onto an electronic component body to form an external electrode by supplying the electroconductive paste to a first groove on an outer circumferential surface of a roller to extend along a circumference of the roller, disposing the electronic component body such that a second main surface of the electronic component body and an outer circumferential surface of the roller are opposed to each other while a first edge portion defined by the second main surface and a first end surface of the electronic component body is in the first groove when viewed in plan, and pressing the electronic component body against the outer circumferential surface of the roller so that the first edge portion is located in the first groove in a depth direction of the first groove.
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