Low dishing copper chemical mechanical planarization

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United States of America Patent

PATENT NO 9978609
SERIAL NO

15001846

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Abstract

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Copper chemical mechanical polishing (CMP) formulation, method and system are disclosed. The CMP formulation comprises particulate materials, at least two or more amino acids, oxidizer, corrosion inhibitor, and rest being water.

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Patent Owner(s)

Patent OwnerAddress
VERSUM MATERIALS US LLC8555 SOUTH RIVER PARKWAY PATENT DEPT TEMPE AS 85284

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Grief, Malcolm Phoenix, US 27 731
O'Neill, Mark Leonard Queen Creek, US 111 11126
Rose, Joseph Chandler, US 12 36
Schlueter, James Allen Phoenix, US 21 108
Shi, Xiaobo Chandler, US 87 369

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